Technical information
Placed in room Q156, Nano-process lab.
Low power descums and residuals removal. Soft-etching technology: precision RF power (<30 W) with etch power down to 1 W and control resolution 1 W. Parallel plate RF etcher (CCP).
Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones).
Tool Overview
Responsible: Amirreza Ghassami, Harald Havir
Location: Q156: EBL room
License and Booking Required: Yes
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