Technical information
The ultrasonic bonder can be equipped with either gold deep access wedge bonding(standard setup) or gold ball bonding. For gold ball bonding, the stage must be heated to approximately 120 degrees Celsius. Wire diameter is 25µm. It is also possible to configure with aluminum deep access wedge bonding. The tool is located in Room Q113.
Tool Overview
Responsible: Max Bäckström
Location: Q113: Bonder room
License and Booking Required: Yes
Other Links