The Chemical Mechanical Polisher (CMP) tool intended for use for the de-layering of thin films, device layers or
blanket depositions and associated processes. It can also be used for substrate wafer processes.
With adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.
Sample dimensions at the moment are 10x8mm coupons, 2" and 4" wafers. Other options can be available but require planning and purchasing of parts. Sizes up to 8" wafers can eventually be processed on this tool, after procurement of eventual needed parts.
Slurry used is SF1 which is a silicon dioxide(amorphous) based. Other slurries available for purchase.
Located in CBE lab Q231
Responsible: Max Bäckström
Location: Q231: CMP lab
License and Booking Required: Yes
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The slurry is very difficult to remove when dry It is of utmost importance that the tool is sprayed down properly with the water gun after use, such that no slurry remains on the tubes (drippers), holders, the tool head(s) or their back pressure fittings. When spraying down the head(s), don't forget the back pressure lines as shown in the video to the left, as those are especially sensitive to build up of dry slurry! |
