Responsible staff

Mask-less Aligner - MLA150

Mask-less Aligner - Heidelberg MLA150
Technical information
  • Non-contact direct write lithography.
  • Exposure of small pieces and full wafers.
  • 6" max wafers or 5" masks
  • Lasers: wavelength = 375nm, 405nm.
  • 0.8um resolution limit and 500nm alignment accuracy
Tool Overview

Responsible: Jason Beech, Harald Havir

Location: Q161: UVL lab

License and Booking Required: Yes