Page History

• Sputter deposition (PVD) system

• Target materials: Au, Al, Ni, Mo, W, Ti, Si, SiO₂, TiN, ITO

• 3 DC magnetrons (2") and 2 RF magnetrons (2")

• Gases: Ar, N₂, O₂

• Process chamber base pressure: low 10^-7 mbar

• Load-lock for quick and easy sample loading

• QCM (Quartz Micro Balance) for monitoring of deposition rate and film thickness

• Maximum wafer size: 4"

Responsible: ~ftf-pbo and George Rydnemalm

Location: Room Q158 - Level 1 (EVA )

License and Booking Required: Yes

User Manuals

Process

Staff Documents

Safety Information

View on LIMS

FAQ

User Discussion Forum